DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Wafer On Film
5.981 (151.92 mm)
Outer Ring O.D.
5.520 (140.2 mm)
Inner Ring I.D.
0.003 (0.076 mm) Nom.
Separation
Between Die
0.003 (0.076 mm)
Separation
Between Die
3.940 (100 mm)
Wafer Dia.
Wafer Film Frame Description
● Wafer on nitto tape
● Color: light blue
● Thickness: 2.2–3 mils
● Tensile strength: 6.6 (lbs. in width)
● Ring material: plastic
Grip Ring
0.236 (5.99 mm)
Ring Thickness
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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May 30, 2006 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200140 Rev. C