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SMB135 View Datasheet(PDF) - Summit Microelectronics

Part Name
Description
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SMB135 Datasheet PDF : 34 Pages
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SMB135
PACKAGE AND PIN DESCRIPTIONS
Ball
Number
(CSP-15)
Pin
Number
(QFN-32)
Pin Name
Pin
Type
A1
1
BATT
I
B1
4
SENSEH
I
C1
5
SENSEL
I
D1
7
COMP
I
E1
10
STAT
O
A2
29
THERM
I/O
B2
27
VDDCAP
PWR
3, 8, 18,
C2
20, 22, 30,
32
3, 8, 18,
D2
20, 22, 30,
32
AGND
GND
PWR
PWR
E2
12
IN
I
A3
25
EN
I
B3
24
USB500/100
I
C3
21
D3
19
E3
14
N/A
33
2, 6, 9, 11,
N/A
13, 15, 16,
17, 23, 26,
28, 31
SDA
SCL
OUT
GND
NC
I/O
I
O
PWR
N/A
Pin Description
Battery Voltage Sense – Connect directly to positive terminal
of battery.
Charge Current Sense – Connect to high-side of charge
current sense resistor.
Charge Current Sense – Connect to low-side of charge
current sense resistor (allows for higher accuracy).
Primary Compensation – Connect to R/C compensation
network.
Status and Fault Indicator.
Battery Thermistor Sense.
VDD Bypass – Connect to VDD bypass capacitor with 1µF or
greater capacitor.
Analog Ground – Connect to isolated PCB ground.
Ground – Connect to isolated PCB ground.
USB (+4.35V to +5.5V) or Adaptor Input (+4.35V to +6.5V) –
Bypass with a 1µF or greater capacitor.
Enable Input (active low) – A logic low signal on this pin
powers-up the device and allows a battery charge cycle to
occur. A logic high signal on this pin forces IN to a high-
impedance, low-current state, and the internal VDD regulator
is powered down. If unused, this pin should be tied to GND.
Charge Current Regulation Setting – Connect to logic high for
500mA or low for 100mA charge current setting. This charging
current can be overridden by I2C but only for values less than
500mA and 100mA respectively. The actual charging values
are (500-IOFFSET) mA and (100-IOFFSET) mA respectively, with
IOFFSET being the device’s total active current (Note 1). When
unused, this pin should be tied to VDDCAP or GND (do not
leave floating).
I2C Bus Data.
I2C Bus Clock.
Charge Current Output – Connect to inductor.
Exposed metal (thermal) Pad on bottom of SMB135. The
thermal pad of the SMB135 package must be connected to
the PCB GND.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
4
 

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