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SL1002A230SM View Datasheet(PDF) - Littelfuse, Inc

Part Name
Description
MFG CO.
SL1002A230SM
Littelfuse
Littelfuse, Inc Littelfuse
SL1002A230SM Datasheet PDF : 5 Pages
1 2 3 4 5
Gas Discharge Tube (GDT) Products
SL1002A Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pb-free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (Min to Max) (ts)
Average Ramp-up Rate (Liquidus Temp
(TL) to peak)
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of Actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (TP)
Do not exceed
150°C
200°C
60 – 180 seconds
3°C/second max.
5°C/second max.
217°C
60 – 150 seconds
260+0/-5 °C
10 – 30 seconds
6°C/second max.
8 minutes max.
260°C
TP
TL
TS(max)
Ramp-up
TS(min)
Preheat
tS
25
time to peak temperature
(t 25ºC to peak)
tP
Critical Zone
TL to TP
tL
Ramp-down
Time
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100° C
150° C
60-180 seconds
Solder Pot Temperature:
280° C Maximum
Solder Dwell Time:
2-5 seconds
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
SL1002A Series
38
Revised: November 10, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
 

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