TMP04 View Datasheet(PDF) - Analog Devices

Part Name

Description

View to exact match

TMP04

Serial Digital Output Thermometers

Analog Devices 

TMP03/TMP04

WAFER TEST LIMITS (V+ = +5 V, GND = 0 V, TA = +25؇C, unless otherwise noted)

Parameter

Symbol

Conditions

Min Typ Max

Units

ACCURACY

Temperature Error

Power Supply Rejection Ratio

PSRR

TA = +25°C1

Over Rated Supply

3.0

°C

1.2

°C/V

OUTPUTS

Output High Voltage, TMP04

VOH

Output Low Voltage, TMP04

VOL

Output Low Voltage, TMP03

VOL

IOH = 800 µA

IOL = 800 µA

ISINK = 1.6 mA

V+ – 0.4

V

0.4

V

0.2

V

POWER SUPPLY

Supply Range

Supply Current

V+

4.5

7

V

ISY

Unloaded

1.3

mA

NOTES

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

1Maximum deviation from ratiometric output transfer function over specified temperature range.

ABSOLUTE MAXIMUM RATINGS*

Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . +9 V

Maximum Output Current (TMP03 DOUT) . . . . . . . . . 50 mA

Maximum Output Current (TMP04 DOUT) . . . . . . . . . 10 mA

Maximum Open-Collector Output Voltage (TMP03) . . +18 V

Operating Temperature Range . . . . . . . . . . . –55°C to +150°C

Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . +175°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +160°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C

*CAUTION

1Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation at or above this specification is not implied. Exposure to the above

maximum rating conditions for extended periods may affect device reliability.

2Digital inputs and outputs are protected, however, permanent damage may occur

on unprotected units from high-energy electrostatic fields. Keep units in conduc-

tive foam or packaging at all times until ready to use. Use proper antistatic handling

procedures.

3Remove power before inserting or removing units from their sockets.

Package Type

ΘJA

ΘJC

Units

TO-92 (T9)

1621

120

°C/W

SO-8 (S)

1581

43

°C/W

TSSOP (RU)

2401

43

°C/W

NOTE

1ΘJA is specified for device in socket (worst case conditions).

DICE CHARACTERISTICS

Die Size 0.050 × 0.060 inch, 3,000 sq. mils

( 1.27 × 1.52 mm, 1.93 sq. mm)

For additional DICE ordering information, refer to databook.

Model

TMP03FT9

TMP03FS

TMP03FRU

TMP03GBC

TMP04FT9

TMP04FS

TMP04FRU

TMP04GBC

ORDERING GUIDE

Accuracy

at +25؇C

Temperature

Range

± 3.0

XIND

± 3.0

XIND

± 3.0

XIND

± 3.0

+25°C

± 3.0

XIND

± 3.0

XIND

± 3.0

XIND

± 3.0

+25°C

Package

TO-92

SO-8

TSSOP-8

Die

TO-92

SO-8

TSSOP-8

Die

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the TMP03/TMP04 features proprietary ESD protection circuitry, permanent damage

may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

REV. 0

–3–

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