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SI-3012KD View Datasheet(PDF) - Sanken Electric co.,ltd.

Part Name
Description
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SI-3012KD Datasheet PDF : 0 Pages
1-1-4 Linear Regulator ICs
Block Diagram
SI-3010KD/SI-3012KD
VIN 2
VC 1
-
+
REF
TSD
4 VO
5 ADJ
3 GND
Typical Connection Diagram
SI-3033KD/SI-3050KD
+
CIN
D1*2
VIN
VO
2
4
VC
1
sense
GND 5
3
*1
+
CO
Load
SI-3033KD/SI-3050KD
VIN 2
VC 1
-
+
REF
TSD
4 Vo
5
Sense
3 GND
SI-3010KD/SI-3012KD
D1*2
+
CIN
VIN
VO
2
4
VC GND ADJ
1 35
*3
*1
R3
R1
+
Load
CO
R2
CIN: Input capacitor (22 µF or larger)
CO: Output capacitor
*1: SI-3012KD/3033KD (22 µF or larger)
Co has to be a low ESR capacitor such as a ceramic capacitor.
When using the electrolytic capacitor, oscillation may occur at a low temperature.
SI-3010KD/3050KD/ (47 µF or larger)
If a low ESR capacitor is used, oscillation may occur.
*2: D1: Reverse bias protection diode
This diode is required for protection against reverse biasing between the input
and output.
(Sanken SJPL-H2 is recommended.)
This diode is not required at VO 3.3V.
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2 as shown
above.
The recommended value for R2 is 10(24kfor SI-3012KD).
R1=(VO–VADJ)÷(VADJ/R2)
*3: For SI-3010KD, insert R3 in case of setting VO to VO 1.5V.
The recommended value for R3 is 10k.
Reference Data
Copper Laminate Area (on Glass-Epoxy Board) vs.
Thermal Resistance (from Junction to Ambient Temperature) (Typical Value)
55
50
When Using Glass-Epoxy Board of 40 × 40 mm
45
40
35
30
0 200 400 600 800 1000 1200 1400 1600 1800
Copper Laminate Area (mm2)
• A higher heat radiation effect can be achieved by enlarging the copper laminate
area connected to the inner frame to which a monolithic ICs is mounted.
• Obtaining the junction temperature
Measure the case temperature TC with a thermocouple, etc. Then, substitute
this value in the following formula to obtain the junction temperature.
Tj=PD × θj–C + TC ( θj–C = 3°C/W) PD= (VIN–VO)•IOUT
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