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SCA1000 View Datasheet(PDF) - Murata Manufacturing

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SCA1000 Datasheet PDF : 14 Pages
First Prev 11 12 13 14
SCA1000 Series
4.2 Reflow Soldering
The SCA1000 is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment.
Figure 12. Recommended SCA1000 body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020B.
Profile feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature min (Tsmin)
- Temperature max (Tsmax)
- Time (min to max) (ts)
Tsmax to T, Ramp up rate
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak temperature (TP)
Time within 5°C of actual Peak Temperature (TP)
Ramp-down rate
Time 25° to Peak temperature
Sn-Pb Eutectic
Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5°C
10-30 seconds
6°C/second max
6 minutes max
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
250 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part
should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end
is 168 hours.
Notes:
Preheating time and temperatures according to guidance from solder paste manufacturer.
It is important that the part is parallel to the PCB plane and that there is no angular alignment
error from intended measuring direction during assembly process.
Wave soldering is not recommended.
Ultrasonic cleaning is not allowed. The sensing element may be damaged by an ultrasonic
cleaning process.
Murata Electronics Oy
www.muratamems.fi
Subject to changes
Doc. nr. 82 1566 00
14/14
Rev.A
 

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