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S29GL016A10BAI022 View Datasheet(PDF) - Spansion Inc.

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Description
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S29GL016A10BAI022 Datasheet PDF : 95 Pages
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Data Sheet
3. Connection Diagrams
3.1
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The package
and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for
prolonged periods of time.
Figure 3.1 48-Pin Standard TSOP
A15
1
A14
2
A13
3
A12
4
A11
5
A10
6
A9
7
A8
8
A191
9
A203
10
WE#
11
RESET#
12
A211,2
13
WP#/ACC1
14
RY/BY#1
15
A18
16
A17
17
A7
18
A6
19
A5
20
A4
21
A3
22
A2
23
A1
24
48-Pin Standard TSOP
48
A16
47
BYTE#1
46
VSS
45
DQ15/A-1
44
DQ7
43
DQ14
42
DQ6
41
DQ13
40
DQ5
39
DQ12
38
DQ4
37
VCC
36
DQ11
35
DQ3
34
DQ10
33
DQ2
32
DQ9
31
DQ1
30
DQ8
29
DQ0
28
OE#
27
VSS
26
CE#
25
A0
Notes
1. Pin 9 is A21, Pin 13 is ACC, Pin 14 is WP#, Pin 15 is A19, and Pin 47 is VIO on S29GL064A (models R6, R7).
2. Pin 13 is NC on S29GL032A, and S29GL016A.
3. Pin 10 is NC on S29GL016A.
10
S29GL-A
S29GL-A_00_A12 May 21, 2008
 

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