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RT9259C View Datasheet(PDF) - Richtek Technology

Part Name
Description
MFG CO.
RT9259C Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
RT9259C
Pa rame te r
Symbol
Test Conditions
Min Typ Max Units
Os cilla tor
Free Running Frequency
Ramp Amplitude
Reference Voltage
PWM Error Amplifier Reference
Linear Driver Reference
Error Amplifier
fOSC
V REF 1
VREF2
RRT = 110kΩ
250 300 350 kHz
--
1.6
--
V
0.792 0.8 0.808 V
0.792 0.8 0.808 V
DC Gain
70
88
--
dB
Gain-Bandwidth Product
Slew Rate
GBW
SR
CLOAD = 5pF
6
15
-- MHz
3
6
-- V/us
Gate Driver
Upper Drive Source
Upper Drive Sink
Lower Drive Source
Lower Drive Sink
P rotec tion
RUGATE
RUGATE
RLGATE
RLGATE
VBOOT VPHASE = 12V,
VBO OT VUGATE = 1V
VUGATE = 1V
VCC – VLGATE = 1V
VLGATE = 1V
--
4
8
Ω
--
4
8
Ω
--
4
6
Ω
--
2
4
Ω
Under Voltage Protection
Soft-Start Time Interval
Over Current Threshold
RT_DIS Shutdown Threshold
VUVP
TSS
VOC
0.36 0.4 0.45 V
2
3
4
ms
-- -400
--
mV
0.35 0.4
--
V
Linear Regulator
Output High Voltage
Output Low Voltage
Source Current
Sink Current
VDRV
VDRV
IDRVSR
IDRVSC
9.5 10.3 --
V
--
0 .1
1
V
2
--
--
mA
0. 5
--
--
mA
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA is measured in the natural convection at TA = 25°C on a high effective 4-layers 2S2P thermal conductivity test board
of JEDEC 51-7 thermal measurement standard.
DS9259C-03 August 2007
www.richtek.com
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