Q32M210
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin Definition and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
ESD and Latch−up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Typical Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Detailed Function Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Example Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Key Features
Ultra Low−Power and Smart Power Management
• Less than 400 mA / MHz, up to 16 MHz clock speed
• Reliable operation down to 1.8 V; 3.3 V nominal supply
voltage
• Ultra−low−current sleep mode with Real−time Clock
active (< 750 nA)
• Low−current standby mode with register and SRAM
retention (< 26 mA)
• Integrated power supplies minimize need for external
components. Only a minimum of external passives is
required
Efficient, Powerful and Robust Processing
Architecture
• 32−bit ARM Cortex−M3 CPU
• 256 kB on−chip flash with integrated hardware ECC for
program and user data storage
• 48 kB on−chip SRAM
• Flexible DMA, 4 general−purpose timers, CRC
calculator
• No external voltage required for flash write operation
Low−Noise, Low−Leakage, Low−Temperature Drift,
Configurable Sensor Interface
• Triple ultra low−noise opamps with low−leakage inputs
and configurable outputs
• Dual on−chip Programmable Gain Amplifiers (PGA)
and ADCs with flexible input multiplexing and wide
dynamic range
• Reconfigurable voltage detection unit
• Optimal dynamic range scaling of sensor signals
• Flexible on−chip signal routing for dynamic
reconfigurability
• Minimal temperature drift of gain and offset errors
allows for precise calibration
• Built−in Temperature Sensor
Predictable Operation
• Dedicated brown−out protection circuit prevents
execution of code outside of operating range
• Integrated hardware−based ECC for on−chip flash
maintains code and data integrity
• Watchdog timer
High Precision Analog−to−Digital Conversion and
Digital−to−Analog Conversion
• Dual 16−bit ADCs with on−the−fly data rate
configurability
• Triple 10−bit DACs with configurable dynamic range
Precision Voltage Reference
• On−chip, low temperature drift (< 50 ppm/°C) voltage
reference for ADCs and DACs
Flexible On−Chip Clocking
• Processor supports speeds up to 16 MHz provided
either through internal oscillator or externally supplied
clock
Flexible Sensor Interconnections
• Triple low Ron analog multiplexers, including an 8:1
input mux
• Quad SPST and quad multi−switches for effective
simultaneous connection to different sensors
USB 2.0 Full−Speed Interface
• Built−in transceiver for 2.0 Full−speed compatible
(12 Mbps) operation with dedicated power supply
Flexible External Interfaes
• Configurable Interface Wakeup pins with configurable
pull−ups and pull−downs
• 8 Configurable GPIO interrupts
• Dual UARTs, dual SPI, SQI, I2C, PCM (including I2S
mode), GPIOs
LCD Interface
• Up to 112 segments with integrated charge pump and
backlight driver (up to 10 mA)
Packaging
• Available in 140−pin TLLGA
http://onsemi.com
2