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ADC0804 View Datasheet(PDF) - Intersil

Part NameDescriptionManufacturer
ADC0804 8-Bit, Microprocessor-Compatible, A/D Converters Intersil
Intersil Intersil
ADC0804 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
ADC0802, ADC0803, ADC0804
Die Characteristics
DIE DIMENSIONS:
(101 mils x 93 mils) x 525µm x 25µm
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
Metallization Mask Layout
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
ADC0802, ADC0803, ADC0804
AGND
VIN (-)
VIN (+)
INTR CLK IN
WR
VREF/2
DGND
DB7 (MSB)
DB6
DB5
DB4
DB3
DB2
DB1
DB0
RD
CS
V+ OR VREF
V+ OR VREF
CLK R
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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