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CXD1171M View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
View to exact match
CXD1171M
Sony
Sony Semiconductor Sony
CXD1171M Datasheet PDF : 13 Pages
First Prev 11 12 13
Package Outline Unit : mm
CXD1171M
24PIN SOP (PLASTIC)
+ 0.4
15.0 0.1
24
13
+ 0.4
1.85 0.15
0.15
+ 0.2
0.1 0.05
1
0.45 ± 0.1
12
1.27
+ 0.1
0.2 0.05
0.24 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-24P-L01
SOP024-P-0300
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
0.3g
LEAD SPECIFICATIONS
ITEM
SPEC.
LEAD MATERIAL
COPPER ALLOY
LEAD TREATMENT
Sn-Bi 2.5%
LEAD TREATMENT THICKNESS 5-18µm
13
Sony Corporation
 

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