NE5539 View Datasheet(PDF) - Philips Electronics
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NE5539 Datasheet PDF : 14 Pages
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Philips Semiconductors
High frequency operational amplifier
Product data
NE/SE5539
CIRCUIT LAYOUT CONSIDERATIONS
As may be expected for an ultra-high frequency, wide-gain
bandwidth amplifier, the physical circuit is extremely critical.
Bread-boarding is not recommended. A double-sided copper-clad
printed circuit board will result in more favorable system operation.
An example utilizing a 28 dB non-inverting amp is shown in Figure 6.
OPTIONAL
OFFSET
ADJ.
+V
–V
R5
R4
R1
75
VIN
R2
75
R1 = 75Ω 5% CARBON
R2 = 75Ω 5% CARBON
R3 = 75Ω 5% CARBON
R4 = 36K 5% CARBON
RF
1nF
+V
RFC
–14
NE5539
7
10
3
8
+1
1nF
470
R6
1nF
RFC
R3 75
75Ω
VOUT TERM
1nF
—V
R5 = 20k TRIMPOT (CERMET)
RF = 1.5k (28dB GAIN)
R6 = 470Ω 5% CARBON
RFC 3T # 26 BUSS WIRE ON
FERROXCUBE VK 200 09/3B CORE
BYPASS CAPACITORS
1nF CERAMIC
(MEPCO OR EQUIV.)
Top Plane Copper1
(Component Side)
Component Side
(Component Layout)
Bottom Plane
Copper1
—V X
R5
X
RFC
R2
R4 R1 +V
(1)
VIN X
XX
X
CC
X
X
RFC
X
X R6
XX
RF
R5
2002 Jan 25
Figure 6. 28dB Non-Inverting Amp Sample PC Layout
8
SL00575
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