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NBSG16VS View Datasheet(PDF) - ON Semiconductor

Part NameDescriptionManufacturer
NBSG16VS 2.5V/3.3V SiGe Differential Receiver/Driver with Variable Output Swing ON-Semiconductor
ON Semiconductor ON-Semiconductor
NBSG16VS Datasheet PDF : 14 Pages
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NBSG16VS
Table 3. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor (D, D)
Internal Input Pullup Resistor (D)
ESD Protection
Human Body Model
Machine Model
Moisture Sensitivity (Note 4)
FCBGA−16
QFN−16
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
4. For additional information, see Application Note AND8003/D.
Value
75 kW
36.5 kW
> 2 kV
> 100 V
Pb Pkg
Pb−Free Pkg
Level 3
Level 1
N/A
Level 1
UL 94 V−0 @ 0.125 in
192
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
VEE
VI
VINPP
IOUT
Positive Power Supply
Negative Power Supply
Positive Input
Negative Input
Differential Input Voltage
Output Current
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
|D − D| VCC − VEE w 2.8 V
VCC − VEE t 2.8 V
Continuous
Surge
VI v VCC
VI w VEE
3.6
V
−3.6
V
3.6
V
−3.6
V
2.8
V
|VCC − VEE|
V
25
mA
50
mA
IIN
Input Current Through RT (50 W Resistor) Static
Surge
45
mA
80
mA
IBB
VBB Sink/Source
IMM
VMM Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
(Note 5)
500 lfpm
0 lfpm
500 lfpm
16 FCBGA
16 FCBGA
16 QFN
16 QFN
1
1
−40 to +85
−65 to +150
108
86
41.6
35.2
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
2S2P (Note 5)
2S2P (Note 6)
16 FCBGA
16 QFN
5.0
°C/W
4.0
°C/W
Tsol
Wave Solder
Pb
Pb−Free
225
°C
225
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
5. JEDEC standard 51−6 multilayer board − 2S2P (2 signal, 2 power).
6. JEDEC standards multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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