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NBSG16VSMN View Datasheet(PDF) - ON Semiconductor

Part NameDescriptionManufacturer
NBSG16VSMN 2.5V/3.3V SiGe Differential Receiver/Driver with Variable Output Swing ON-Semiconductor
ON Semiconductor ON-Semiconductor
NBSG16VSMN Datasheet PDF : 14 Pages
First Prev 11 12 13 14
NBSG16VS
PACKAGE DIMENSIONS
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−X−
−Y−
E
FCBGA−16
BA SUFFIX
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
CASE 489−01
ISSUE O
D
M
K
0.20
3X e
S
M
4321
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
A
B
C
D
VIEW M−M
3
16 X b
0.15 M Z X Y
0.08 M Z
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
MILLIMETERS
DIM MIN MAX
A
1.40 MAX
A1 0.25 0.35
A2 1.20 REF
b 0.30 0.50
D
4.00 BSC
E
4.00 BSC
e
1.00 BSC
S
0.50 BSC
A A2
5
0.15 Z
A1
4
16 X
0.10 Z
DETAIL K
ROTATED 90 _CLOCKWISE
−Z−
http://onsemi.com
13
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