NBSG16M
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
VEE
VI
VINPP
Positive Power Supply
Negative Power Supply
Positive Input
Negative Input
Differential Input Voltage |D − D|
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
VCC − VEE w 2.8 V
VCC − VEE < 2.8 V
VI v VCC
VI w VEE
3.6
V
−3.6
V
3.6
V
−3.6
V
2.8
V
|VCC − VEE|
IIN
Input Current Through RT (50 W Resistor) Static
Surge
45
mA
80
mA
Iout
Output Current
Continuous
Surge
25
mA
50
mA
IBB
VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
(Note 5)
500 lfpm
QFN−16
QFN−16
1.0
−40 to +85
−65 to +150
42
35
mA
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
1S2P (Note 5)
QFN−16
Tsol
Wave Solder
Pb <2 to 3 sec @ 248°C
Pb−Free <2 to 3 sec @ 260°C
4.0
°C/W
265
°C
265
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
5. JEDEC standard multilayer board − 1S2P (1 signal, 2 power)
http://onsemi.com
4