NB6L11DR2 View Datasheet(PDF) - ON Semiconductor
Part Name
Description
View to exact match
NB6L11DR2 Datasheet PDF : 12 Pages
| |||
NB6L11
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
VEE
VI
VINPP
Positive Power Supply
Negative Power Supply
Positive Input Voltage
Negative Input Voltage
Differential Input Voltage
Iout
Output Current
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
|D − D| VCC − VEE w 2.8 V
VCC − VEE t 2.8 V
Continuous
Surge
VI v VCC
VI w VEE
3.6
V
−3.6
V
3.6
V
−3.6
V
2.8
V
|VCC − VEE|
25
mA
50
mA
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
SOIC−8
SOIC−8
−40 to +85
−65 to +150
190
130
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
SOIC−8
TSSOP−8
TSSOP−8
41 to 44
185
140
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
Tsol
Wave Solder
Standard v 3 sec @ 248°C
Pb−Free v 3 sec @ 260°C
41 to 44
265
265
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
3
|
|
Share Link: 