NBB-300-T1 View Datasheet(PDF) - RF Micro Devices

Part Name

Description

View to exact match

NBB-300-T1

CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz

RF Micro Devices 

NBB-300

Chip Outline Drawing - NBB-300-D

Chip Dimensions: 0.017” x 0.017” x 0.004”

UNITS:

Inches

(mm)

Back of chip is ground.

OUTPUT

INPUT

GND

VIA

0.017 ± 0.001

(0.44 ± 0.03)

0.017 ± 0.001

(0.44 ± 0.03)

0.004 ± 0.001

(0.10 ± 0.03)

Sales Criteria - Unpackaged Die

Die Sales Information

• All segmented die are sold 100% DC-tested. Testing parameters for wafer-level sales of die material shall be nego-

tiated on a case-by-case basis.

• Segmented die are selected for customer shipment in accordance with RFMD Document #6000152 - Die Product

Final Visual Inspection Criteria1.

• Segmented die has a minimum sales volume of 100 pieces per order. A maximum of 400 die per carrier is allow-

able.

Die Packaging

• All die are packaged in GelPak ESD protective containers with the following specification:

O.D.=2"X2", Capacity=400 Die (20X20 segments), Retention Level=High(X0).

• GelPak ESD protective containers are placed in a static shield bag. RFMD recommends that once the bag is

opened the GelPak/s should be stored in a controlled nitrogen environment. Do not press on the cover of a closed

GelPak, handle by the edges only. Do not vacuum seal bags containing GelPak containers.

• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit 2.

Package Storage

• Unit packages should be kept in a dry nitrogen environment for optimal assembly, performance, and reliability.

• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit2.

Die Handling

• Proper ESD precautions must be taken when handling die material.

• Die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of twee-

zers. Do not touch die with any part of the body.

• When using automated pick-up and placement equipment, ensure that force impact is set correctly. Excessive force

may damage GaAs devices.

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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

Rev A11 DS070328

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