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MSA-2743-BLK View Datasheet(PDF) - HP => Agilent Technologies

Part Name
Description
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MSA-2743-BLK
HP
HP => Agilent Technologies HP
MSA-2743-BLK Datasheet PDF : 17 Pages
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MSA-2743 Typical Scattering Parameters
TA = 25°C, Id = 50 mA
Freq
s11
s11
s21
(GHz) Mag
Ang
(dB)
s21
(Mag)
s21
(Ang)
s12
s12
s22
s22
K
(Mag) (Ang) (Mag) (Ang)
0.1
0.022
0.5
0.042
0.9
0.061
1.0
0.068
1.5
0.1
1.9
0.124
2.0
0.13
2.5
0.155
3.0
0.172
3.5
0.179
4.0
0.17
4.5
0.164
5.0
0.155
5.5
0.147
6.0
0.155
6.5
0.185
7.0
0.213
7.5
0.242
8.0
0.276
8.5
0.328
9.0
0.401
9.5
0.496
10.0
0.583
158
102.4
57.9
51.3
26.5
11.6
8.2
-6.4
-17.7
-28.2
-41.3
-57.6
-76.6
-100.9
-129.7
-155.9
-177.8
160
139.1
120.4
101.3
82.5
65
16.15
16.11
16.01
15.98
15.8
15.63
15.58
15.33
15.04
14.75
14.47
14.2
13.9
13.59
13.28
12.9
12.5
12.02
11.52
11.04
10.52
9.93
9.04
6.423
6.387
6.319
6.296
6.169
6.044
6.01
5.842
5.652
5.461
5.29
5.13
4.955
4.783
4.613
4.415
4.215
3.991
3.765
3.563
3.357
3.139
2.832
176.8
164.3
151.9
148.8
133.6
121.7
118.7
104.1
89.8
75.9
62.2
48.4
34.6
21.1
7.4
-6.5
-20.1
-33.8
-47.4
-60.8
-74.7
-89.5
-104.5
0.104
0.103
0.1
0.1
0.097
0.095
0.095
0.093
0.092
0.091
0.091
0.091
0.091
0.091
0.094
0.097
0.104
0.112
0.121
0.136
0.157
0.18
0.197
-0.8
0.065
-4.1
0.068
-6.5
0.085
-7.1
0.089
-9.2
0.103
-10.5
0.109
-10.8
0.109
-12.2
0.103
-13.5
0.083
-14.6
0.064
-15.8
0.058
-16.7
0.064
-17.6
0.07
-17.8
0.084
-17.5
0.095
-17.5
0.118
-17.3
0.147
-18.8
0.167
-20.4
0.189
-21.5
0.231
-25.9
0.295
-33.6
0.385
-43.2
0.477
-5.4
1.1
-26.7
1.1
-52.7
1.1
-57.3
1.1
-73.1
1.1
-82.9
1.1
-85.1
1.2
-99.9
1.2
-117.6
1.2
-137
1.2
-165.5
1.2
166.8
1.3
153.9
1.3
152.6
1.3
149.9
1.3
150.2
1.3
144.2
1.3
132.9
1.2
120.1
1.2
109.2
1.1
95
0.9
80.5
0.8
65.2
0.7
Notes:
1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead.
The output reference plane is at the end of the output lead. The parameters include the effect of four plated through via holes connecting ground
landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the carrier. Two 0.020 inch diameter via holes are placed
within 0.010 inch from each ground lead contact point, one via on each side of that point.
5
 

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