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MOC3031VM View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
MOC3031VM Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Package Dimensions
Through Hole
8.13–8.89
6
4
6.10–6.60
Pin 1 1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
7.62 (Typ.)
0.4" Lead Spacing
8.13–8.89
6
4
6.10–6.60
Pin 1 1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
0.38 (Min.)
(0.86)
1.02–1.78
2.54–3.81
2.54 (Bsc)
0.41–0.51
0.76–1.14
15° (Typ.)
0.20–0.30
0.38 (Min.)
(0.86)
1.02–1.78
2.54–3.81
2.54 (Bsc)
0.41–0.51
0.76–1.14
0.20–0.30
10.16–10.80
Surface Mount
8.13–8.89
6
4
6.10–6.60
8.43–9.90
(1.78)
(7.49)
(10.54)
(2.54)
(1.52)
1
3
Pin 1
0.25–0.36
3.28–3.53
5.08
(Max.)
0.38 (Min.)
(0.86)
1.02–1.78
2.54 (Bsc)
0.41–0.51
0.76–1.14
Note:
All dimensions in mm.
(0.76)
Rcommended Pad Layout
0.16–0.88
(8.13)
0.20–0.30
©2005 Fairchild Semiconductor Corporation
MOC303XM, MOC304XM Rev. 1.0.7
9
www.fairchildsemi.com
 

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