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FGB20N6S2DT View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FGB20N6S2DT
Fairchild
Fairchild Semiconductor Fairchild
FGB20N6S2DT Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
July 2002
FGH20N6S2D / FGP20N6S2D / FGB20N6S2D
600V, SMPS II Series N-Channel IGBT with Anti-Parallel StealthTM Diode
General Description
Features
The FGH20N6S2D FGP20N6S2D, FGB20N6S2D are Low
Gate Charge, Low Plateau Voltage SMPS II IGBTs
combining the fast switching speed of the SMPS IGBTs
along with lower gate charge, plateau voltage and high
avalanche capability (UIS). These LGC devices shorten
delay times, and reduce the power requirement of the gate
drive. These devices are ideally suited for high voltage
switched mode power supply applications where low
conduction loss, fast switching times and UIS capability are
essential. SMPS II LGC devices have been specially
designed for:
• Power Factor Correction (PFC) circuits
• Full bridge topologies
• Half bridge topologies
• Push-Pull circuits
• Uninterruptible power supplies
• Zero voltage and zero current switching circuits
• 100kHz Operation at 390V, 7A
• 200kHZ Operation at 390V, 5A
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . 85ns at TJ = 125oC
• Low Gate Charge . . . . . . . . . 30nC at VGE = 15V
• Low Plateau Voltage . . . . . . . . . . . . .6.5V Typical
• UIS Rated . . . . . . . . . . . . . . . . . . . . . . . . . 100mJ
• Low Conduction Loss
• Low Eon
• Soft Recovery Diode
IGBT (co-pack) formerly Developmental Type TA49332
(Diode formerly Developmental Type TA49469)
Package
Symbol
TO-247
E
C
G
TO-220AB
E
C
G
TO-263AB
C
G
G
E
E
Device Maximum Ratings TC= 25°C unless otherwise noted
COLLECTOR (FLANGE)
Symbol
Parameter
Ratings
Units
BVCES Collector to Emitter Breakdown Voltage
600
V
IC25
Collector Current Continuous, TC = 25°C
28
A
IC110
Collector Current Continuous, TC = 110°C
13
A
ICM
Collector Current Pulsed (Note 1)
40
A
VGES
Gate to Emitter Voltage Continuous
±20
V
VGEM Gate to Emitter Voltage Pulsed
±30
V
SSOA Switching Safe Operating Area at TJ = 150°C, Figure 2
35A at 600V
A
EAS
Pulsed Avalanche Energy, ICE = 7.0A, L = 4mH, VDD = 50V
100
mJ
PD
Power Dissipation Total TC = 25°C
125
W
Power Dissipation Derating TC > 25°C
1.0
W/°C
TJ
Operating Junction Temperature Range
-55 to 150
°C
TSTG
Storage Junction Temperature Range
-55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. Pulse width limited by maximum junction temperature.
©2002 Fairchild Semiconductor Corporation
FGH20N6S2D / FGP20N6S2D / FGB20N6S2D Rev. A1
 

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