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MC74AC574M データシートの表示(PDF) - ON Semiconductor

部品番号コンポーネント説明メーカー
MC74AC574M Octal D Flip?Flop with 3?State Outputs ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74AC574M Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
−A−
20
1
−T−
SEATING
PLANE
E
G
F
MC74AC574, MC74ACT574
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
L
M
J 20 PL
0.25 (0.010) M T B M
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E 0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M
0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
D
A
q
20
11
E
1
10
20X B
B
0.25 M T A S B S
18X e
A
SEATING
PLANE
A1 T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
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