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MC74AC574M データシートの表示(PDF) - ON Semiconductor

部品番号コンポーネント説明メーカー
MC74AC574M Octal D Flip?Flop with 3?State Outputs ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74AC574M Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
MC74AC574, MC74ACT574
FUNCTIONAL DESCRIPTION
The MC74AC574/74ACT574 consists of eight edge-
triggered flip−flops with individual D−type inputs and
3−state true outputs. The buffered clock and buffered Output
Enable are common to all flip−flops. The eight flip−flops
will store the state of their individual D inputs that meet the
setup and hold time requirements on the LOW−to−HIGH
Clock (CP) transition. With the Output Enable (OE) LOW,
the contents of the eight flip−flops are available at the
outputs. When OE is HIGH, the outputs go to the high
impedance state. Operation of the OE input does not affect
the state of the flip−flops.
FUNCTION TABLE
Inputs
OE CP D
H
H
L
H
H
H
H
L
H
H
L
L
L
H
L
H
L
L
H
H
Internal
Q
NC
NC
L
H
L
H
NC
NC
Outputs
On
Z
Z
Z
Z
L
H
NC
NC
Function
Hold
Hold
Load
Load
Data Available
Data Available
No Change in Data
No Change in Data
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
= LOW-to-HIGH Clock Transition
NC = No Change
D0
D1
D2
D3
D4
D5
D6
D7
CP
CD
Q
CD
Q
CD
Q
CD
Q
CD
Q
CD
Q
CD
Q
CD
Q
OE
O0
O1
O2
O3
O4
O5
O6
O7
NOTE: This diagram is provided only for the understanding of logic operations
and should not be used to estimate propagation delays.
Figure 3. Logic Diagram
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
VOUT
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
IIN
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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