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MC74AC157M View Datasheet(PDF) - ON Semiconductor

Part Name
Description
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MC74AC157M
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74AC157M Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
MC74AC157, MC74ACT157
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE O
0.15 (0.006) T U S
16
2X L/2
L
PIN 1
IDENT.
1
0.15 (0.006) T U S
C
0.10 (0.004)
−T− SEATING
PLANE
D
16X K REF
0.10 (0.004) M
9
8
A
−V−
T U S VS
B
−U−
J
N
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
J1
K
K1
ÇÇÇÉÉÇÇÇÉÉÇÇÇ SECTION N−N
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
0.25 (0.010)
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
M
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
F
G
0.65 BSC
0.026 BSC
H 0.18 0.28 0.007 0.011
DETAIL E
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
−W−
L
M
6.40 BSC
0_ 8_
0.252 BSC
0_ 8_
H DETAIL E
G
http://onsemi.com
8
 

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