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D006 View Datasheet(PDF) - California Micro Devices => Onsemi

Part Name
Description
View to exact match
D006
CMD
California Micro Devices => Onsemi CMD
D006 Datasheet PDF : 6 Pages
1 2 3 4 5 6
CALIFORNIA MICRO DEVICES
SOIC - TOP VIEW
PAC DN006
Power Derating Curve
Mechanical Specifications
Lead Plating
Tin-Lead
Lead Material
Copper Alloy
Lead Coplanarity
0.004" (0.102mm)
Substrate Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94V-0
C
L
Package Dimensions, Power Dissipation & Information
Package
SOIC
Pins #
8
JEDEC
MS 012
mm
inches
min
max
min
max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.19
0.150
0.165
e
1.27 BSC
0.500 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.099
0.0196
L
0.40
1.27
0.016
0.050
PD @ 70 C
# / tube
500mW
100 pcs
# / tape & reel
2,500 pcs
Printed on
recycled Paper
©1999 California Micro Devices Corp. All rights reserved.
6
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
C0240298D
Rev 1 3/99
 

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