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MC33886VWR2 View Datasheet(PDF) - Motorola => Freescale

Part Name
Description
View to exact match
MC33886VWR2
Motorola
Motorola => Freescale Motorola
MC33886VWR2 Datasheet PDF : 20 Pages
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Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Supply Voltage
V+
40
V
Input Voltage (Note 1)
FS Status Output (Note 2)
Continuous Current (Note 3)
VIN
V FS
IOUT
-0.1 to 7.0
V
7.0
V
5.0
A
ESD Voltage for DH Package
Human Body Model (Note 4)
Machine Model (Note 5)
VESD1
VESD2
V
±2000 (Note 6)
±200
ESD Voltage for VW Package
Human Body Model (Note 4)
Machine Model (Note 5)
Storage Temperature
Ambient Operating Temperature (Note 7)
Operating Junction Temperature
Terminal Soldering Temperature (Note 8)
DH Suffix
VW (Pb-Free Suffix)
VESD1
VESD2
V
±2000
±200
TSTG
-65 to 150
°C
TA
-40 to 125
°C
TJ
-40 to 150
°C
TSOLDER
°C
220
260
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W) (Note 9)
RθJB
~5.0
°C/W
Notes
1. Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
2. Exceeding the pull-up resistor voltage on the open drain FS terminal may cause permanent damage to the device.
3. Continuous current capability so long as junction temperature is 150°C.
4. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
5. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
6. All terminals are capable of Human Body Model ESD voltages of ±2000 V with two exceptions pertaining only to the DH suffix package:
(1) D2 to PGND is capable of ±1500 V and (2) OUT1 to AGND is capable of ±1000 V.
7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
8. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual RθJB (junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
33886
4
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