MC33882FC View Datasheet(PDF) - Motorola => Freescale

Part Name

Description

View to exact match

MC33882FC

SIX-OUTPUT LOW-SIDE SWITCH

Motorola => Freescale 

Freescale Semiconductor, Inc.

MAXIMUM RATINGS (continued)

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Limit

THERMAL RESISTANCE (Note 9), (Note 10)

Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (Note 11)

HSOP

QFN

RθJA

°C/W

41

85

Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p) (Note 12)

HSOP

QFN

RθJMA

°C/W

18

27

Junction-to-Board (Bottom)

HSOP

QFN

RθJB

°C/W

3.0

10

Junction-to-Case (Top) (Note 13)

HSOP

QFN

RθJC

°C/W

0.2

1.2

Notes

9. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

10. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board near the package.

11. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

12. Per JEDEC JESD51-6 with the board horizontal.

13. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC 883,

Method 1012.1) with the cold plate temperature used for the case temperature.

33882

8

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