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MC33076D View Datasheet(PDF) - Motorola => Freescale

Part Name
Description
MFG CO.
MC33076D Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Figure 25. Percent Overshoot
versus Load Capacitance
100
VCC = +15 V
80
VEE = –15 V
TA = 25°C
60
RL = 2.0 k
40
RL = 100
20
0
10
100
1000
CL, LOAD CAPACITANCE (pF)
MC33076
Figure 26. PC Board Heatsink Example
Copper
Pad
Copper
Pad
10 k
APPLICATIONS INFORMATION
The MC33076 dual operational amplifier is available in the
standard 8–pin plastic dual–in–line (DIP) and surface mount
packages, and also in a 16–pin batwing power package. To
enhance the power dissipation capability of the power
package, Pins 4, 5, 12, and 13 are tied together on the
leadframe, giving it an ambient thermal resistance of 52°C/W
typically, in still air. The junction–to–ambient thermal
resistance (RθJA) can be decreased further by using a copper
padb on the printed circuit board (as shown in Figure 26) to
draw the heat away from the package. Care must be taken
not to exceed the maximum junction temperature or damage
to the device may occur.
8
MOTOROLA ANALOG IC DEVICE DATA
 

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