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MC14002BCL View Datasheet(PDF) - Motorola => Freescale

Part NameDescriptionManufacturer
MC14002BCL B-Suffix Series COMS Gates Motorola
Motorola => Freescale Motorola
MC14002BCL Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
14
9
–B–
1
7
C
L
–T–
SEATING
PLANE
F
K
G
N
D 14 PL
0.25 (0.010) M T A S
M
J 14 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.94
B 0.245 0.280 6.23 7.11
C 0.155 0.200 3.94 5.08
D 0.015 0.020 0.39 0.50
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC
7.62 BSC
M
0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
14
1
A
F
H
G
8
B
7
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
L
C
N
J
SEATING
PLANE
K
D
M
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
G 0.100 BSC
2.54 BSC
H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L
0.300 BSC
7.62 BSC
M 0_ 10_ 0_ 10_
N 0.015 0.039 0.39 1.01
MC14001B
16
MOTOROLA CMOS LOGIC DATA
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