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MC100LVELT20DR2G View Datasheet(PDF) - ON Semiconductor

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MC100LVELT20DR2G Datasheet PDF : 6 Pages
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MC100LVELT20
Table 4. LVTTL INPUT DC CHARACTERISTICS (VCC = 3.3 V, GND = 0 V, TA = 40°C to +85°C)
Symbol
Characteristic
Min
Typ
Max
Unit
IIH
Input HIGH Current (Vin = 2.7 V)
IIHH
Input HIGH Current MAX (Vin = 6.0 V)
IIL
Input LOW Current (Vin = 0.5 V)
VIK
Input Clamp Voltage (Iin = 18 mA)
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
20
mA
100
mA
0.6
mA
1.2
V
2.0
V
0.8
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 5. 100LVELT PECL OUTPUT DC CHARACTERISTICS (VCC = 3.3 V, GND = 0 V (Note 1))
40°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
ICC
Negative Power Supply Current
VOH
Output HIGH Voltage (Note 2)
VOL
Output LOW Voltage (Note 2)
20
25
30
22
27
32
23
28
33
mA
2155 2280 2405 2155 2280 2405 2155 2280 2405 mV
1355 1480 1605 1355 1480 1605 1355 1480 1605 mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Output parameters vary 1:1 with VCC.
2. All loading with 50ĂW to VCC 2.0 V.
Table 6. AC CHARACTERISTICS (VCC = 3.0 V to 3.6 V, GND = 0 V (Note 1))
40°C
25°C
85°C
Symbol
fmax
Characteristic
Maximum Input Clock Frequency
(Figure 2)
Min Typ Max Min Typ Max Min Typ Max Unit
600 800
600 800
600 800
MHz
tPLH,
tPHL
tSKEW
tJITTER
Propagation Delay to
Output Differential
Device-to-Device Skew (Note 2)
Random Clock Jitter (RMS)
(Figure 2)
280 350 430 300 370 450 320 400 490 ps
250
<1 <2
250
<1 <2
250 ps
< 1 < 2 ps
tr
Output Rise/Fall Times
70 100 225 80 120 225 90 140 225 ps
tf
Q, Q
(20% 80%)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Measured using a LVTTL source, 50% duty cycle clock source. All loading with 50ĂW to VCC 2.0 V.
2. Skew is measured between outputs under identical transitions.
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