MAX9880A View Datasheet(PDF) - Maxim Integrated
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MAX9880A Datasheet PDF : 70 Pages
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Low-Power, High-Performance
Dual I2S Stereo Audio Codec
ABSOLUTE MAXIMUM RATINGS
(Voltages with respect to AGND.)
LINL, LINR, MICLP/DIGMICDATA,
DVDD, AVDD, PVDD ................................................-0.3V to +2V
MICLN/DIGMICCLK, MICRP/SPDMDATA,
DVDDS1, JACKSNS, MICVDD ..............................-0.3V to +3.6V
DGND, PGND........................................................-0.1V to +0.1V
PREG, REF, REG ....................................-0.3V to (VAVDD + 0.3V)
MICBIAS .............................................-0.3V to (VMICVDD + 0.3V)
MCLK, LRCLKS1, BCLKS1,
SDINS1, SDOUTS1..........................-0.3V to (VDVDDS1 + 0.3V)
X1, X2, LRCLKS2, BCLKS2, SDINS2,
SDOUTS2, DOUT, MODE ...................-0.3V to (VDVDD + 0.3V)
SDA/DIN, SCL/SCLK, CS, IRQ ..............................-0.3V to +3.6V
LOUTP, LOUTN, ROUTP, ROUTN,
MICRN/SPDMCLK ...............................-0.3V to (VAVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
48-Bump WLP (derate 12.5mW/°C above +70°C) .....1000mW
48-Pin TQFN (derate 37mW/°C above +70°C) ..........2963mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
LOUTL, LOUTR ....................(VPGND - 0.3V) to (VPVDD + 0.3V)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θJA)...............27°C/W
Junction-to-Case Thermal Resistance (θJC)......................1°C/W
WLP
Junction-to-Ambient Thermal Resistance (θJA)................42°C/W
Junction-to-Case Thermal Resistance (θJC).......................5°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VAVDD = VPVDD = VMICVDD = VDVDD = VDVDDS1 = +1.8V, RL = ∞, headphone load (RL) connected between _OUTP and _OUTN, dif-
ferential modes, CREF = 2.2µF, CMICBIAS = CPREG = CREG = 1µF, AVPRE = +20dB, AVPGAM = 0dB, AVDAC = 0dB, AVLINE = +20dB,
AVVOL = 0dB, AVLO = 0dB, fMCLK = 13MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER
Supply Voltage Range
Total Supply Current
Shutdown Supply
Current
Shutdown to Full
Operation
SYMBOL
CONDITIONS
PVDD, DVDD, AVDD
DVDDS1, MICVDD
Full-duplex 8kHz
mono (Note 3)
Analog (AVDD + PVDD +
MICVDD)
Digital (DVDD + DVDDS1)
IVDD
DAC playback
48kHz stereo
(Note 3)
Full-duplex 48kHz
stereo (Note 3)
Analog (AVDD + PVDD +
MICVDD)
Digital (DVDD + DVDDS1)
Analog (AVDD + PVDD +
MICVDD)
Digital (DVDD + DVDDS1)
Stereo line-in to
line-out only,
TA = +25°C
Analog (AVDD + PVDD +
MICVDD)
Digital (DVDD + DVDDS1)
TA = +25°C
Analog (AVDD + PVDD +
MICVDD)
Digital (DVDD + DVDDS1)
Excludes PLL lock time
MIN
TYP MAX UNITS
1.65
1.8
1.95
V
1.65
1.8
3.6
5.33
8
1.4
2
3.5
6
2.5
4
mA
8.4
12
3.0
5
4.9
8
0.012 0.05
0.3
2
µA
2.6
8
10
ms
2 _______________________________________________________________________________________
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