M93C86, M93C76, M93C66, M93C56, M93C46
Figure 2. DIP, SO, TSSOP and MLP connections (top view)
1. See Package mechanical data section for package dimensions, and how to identify pin-1.
2. DU = Don’t Use.
The DU (do not use) pin does not contribute to the normal operation of the device. It is
reserved for use by STMicroelectronics during test sequences. The pin may be left
unconnected or may be connected to VCC or VSS.