M24C16-F View Datasheet(PDF) - STMicroelectronics
Part Name
Description
View to exact match
M24C16-F Datasheet PDF : 39 Pages
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Package mechanical data
9
Package mechanical data
M24C16-W M24C16-R M24C16-F
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
For die information concerning the M24C16 delivered in unsawn wafer, please contact your
nearest ST Sales Office.
Figure 13. UFDFPN5 (MLP5) – package outline (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
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1. On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from
the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner.
Table 18. UFDFPN5 (MLP5) – package dimensions (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
Symbol
millimeters
Typ
Min
Max
inches(1)
Typ
Min
Max
A
0.550
0.500
0.600
0.0217
A1
–
0
0.050
–
b
0.220
0.180
0.260
0.0087
D
1.700
1.600
1.800
0.0669
D1
1.500
1.400
1.600
0.0591
E
1.400
1.300
1.500
0.0551
E1
0.220
0.180
0.260
0.0087
e
0.400
–
–
0.0157
L
0.550
0.500
0.600
0.0217
k
0.400
–
–
0.0157
1. Values in inches are converted from mm and rounded to four decimal digits.
0.0197
0
0.0071
0.0630
0.0551
0.0512
0.0071
–
0.0197
–
0.0236
0.0020
0.0102
0.0709
0.0630
0.0591
0.0102
–
0.0236
–
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