LSM303DLH View Datasheet(PDF) - STMicroelectronics
Part Name
Description
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LSM303DLH Datasheet PDF : 0 Pages
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LSM303DLH
10 Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 6. LGA-28: mechanical data and package dimensions
Dimensions
Ref.
t(s) A1
c A2
u A3
rod D1
P E1
te L1
le L2
o N1
bs M
O T1
- T2
t(s) d
k
Obsolete Produc h
Min.
4.850
4.850
0.040
0.260
0.360
mm
Typ.
0.785
0.200
5.000
5.000
1.650
3.300
0.550
0.100
0.300
0.400
0.200
0.050
0.100
Max.
1
5.150
5.150
0.160
0.340
0.440
Outline and
mechanical data
LGA-28 (5x5x1)
Land Grid Array Packages
8192208_B
Doc ID 16941 Rev 1
45/47
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