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LM323 View Datasheet(PDF) - ON Semiconductor

Part Name
Description
View to exact match
LM323
ON-Semiconductor
ON Semiconductor ON-Semiconductor
LM323 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
LM323, LM323A
MAXIMUM RATINGS
Input Voltage
Power Dissipation
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 s)
Rating
Symbol
Vin
PD
TJ
Tstg
Tsolder
Value
20
Internally Limited
0 to +125
–65 to +150
300
Unit
Vdc
W
°C
°C
°C
ELECTRICAL CHARACTERISTICS (TJ = Tlow to Thigh [Note 1], unless otherwise noted.)
LM323A
LM323
Characteristics
Symbol Min
Typ
Max
Min
Typ
Max
Unit
Output Voltage
(Vin = 7.5 V, 0 Iout 3.0 A, TJ = 25°C)
VO
4.9
5.0
5.1
4.8
5.0
5.2
V
Output Voltage
(7.5 V Vin 15 V, 0 Iout 3.0 A,
P Pmax) (Note 2)
Line Regulation
(7.5 V Vin 15 V, TJ = 25°C) (Note 3)
VO
4.8
5.0
5.2
4.75
5.0
5.25
V
Regline
1.0
15
1.0
25
mV
Load Regulation
(Vin = 7.5 V, 0 Iout 3.0 A, TJ = 25°C)
(Note 3)
Regload
10
50
10
100
mV
Thermal Regulation
(Pulse = 10 ms, P = 20 W, TA = 25°C)
Regtherm
0.001 0.01
0.002 0.03 %VO/W
Quiescent Current
(7.5 V Vin 15 V, 0 Iout 3.0 A)
Output Noise Voltage
(10 Hz f 100 kHz, TJ = 25°C)
IB
3.5
10
3.5
20
mA
VN
40
40
µVrms
Ripple Rejection
(8.0 V Vin 18 V, Iout = 2.0A,
f = 120 Hz, TJ = 25°C)
Short Circuit Current Limit
(Vin = 15 V, TJ = 25°C)
(Vin = 7.5 V, TJ = 25°C)
Long Term Stability
RR
66
75
62
75
dB
ISC
A
4.5
4.5
5.5
5.5
S
35
35
mV
Thermal Resistance, Junction–to–Case (Note 4)
RΘJC
2.0
2.0
°C/W
NOTES: 1. Tlow to Thigh = 0° to +125°C
2. Although power dissipation is internally limited, specifications apply only for P Pmax = 25 W.
3. Load and line regulation are specified at constant junction temperature. Pulse testing is required with a pulse width 1.0 ms and a duty cycle 5%.
4. Without a heatsink, the thermal resistance (RθJA is 65°C/W). With a heatsink, the effective thermal resistance can approach the specified values of
2.0°C/W, depending on the efficiency of the heatsink.
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