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KIA2431M データシートの表示(PDF) - KEC

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KIA2431M Datasheet PDF : 6 Pages
1 2 3 4 5 6
KIA2431P/S/T/M/AP/AS/AT/AM/BM
PRECAUTION FOR USE
SOLDERING
Flat Package (TSM/TSV/SOT-23 Package)
Elements mounting styles of electronic devices are gaining in further diversification over recent
years, and needs for components are all the more expanding in varieties. Especially, surface mounting
is steadily penetrating into industrial segments as a world-wide popular technical trend.
Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering
temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability.
(a) When employing solder reflow method
Atmospheric temperature around resin surfaces must be less than 240, not exceeding the time length of 10 sec.
Recommend temperature profile
Precautions on heating method
When resin in kept exposed to high temperature for a long time, device reliability may be marred.
Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.
(b) When employing halogen lamps or infrared-ray heaters
When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause
extensive localized temperature rise.
Please keep a reflow solder operating when TSM/TSV package's soldering.
2011. 7. 6
Revision No : 6
6/6
 

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