TDA8133D_09 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

View to exact match

TDA8133D_09

+5.1 V and +8 V dual voltage regulator with disable and reset functions

STMicroelectronics 

TDA8133

Power dissipation and layout indications

5

Power dissipation and layout indications

The power is mainly dissipated by the two device buffers. It can be calculated by the

equation:

P = (VIN1-VO1) x IO1 + (VIN2-VO2) x IO2

The following table lists the different RthJA values of these packages with or without a heat

sink and the corresponding maximum power dissipation assuming:

● Maximum ambient temperature = 70° C

● Maximum junction temperature = 140° C

Table 5. Power dissipation

Device

Heat Sink

RthJA in °C/W

PMAX in W

No

50

1.4

TDA8133

Yes

t(s) No

TDA8133D

Yes

20

56 to 40

32

3.5

1.25 to 1.75

2.2

duc Figure 8. Thermal resistance (junction-to-ambient) for DIP16 package without heatsink

Pro To optimize the thermal conductivity of the copper

te 60

layer and the exchanges with the air, the solder

must cover the maximum amount of this area

ole 55

s Test board with

b 50

“on board” square heat sink area

- O 45

t(s) 40

c 0

2

4

6

8

10 12

u Copper area (cm²) (35 µm plus solder) board is face-down

Obsolete Prod Figure 9. Metal plate mounted near the TDA8133D for heatsinking

Top View

Bottom View

9/14

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