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ISL80103IR25Z-T View Datasheet(PDF) - Intersil

Part Name
Description
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ISL80103IR25Z-T Datasheet PDF : 15 Pages
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ISL80102, ISL80103
Block Diagram
10µA
10µA
R8
R7
R9
ENABLE
SS
EN
M7
V TO I
M8
EN
R5
M5
IL/10,000
M4
M3
VIN
M1
POWER PMOS
IL
VOUT
+
-
EN
EN
+
-
M6
-
+ 500mV
EN
500mV +
-
-
+
485mV
+
-
LEVEL
SHIFT
R4
M2
R1
SENSE
R2
ADJ
PG
*R3
GND
*R3 is open for ADJ versions.
Ordering Information
PART NUMBER
(Notes 1, 2, 4)
ISL80102IRAJZ
PART
MARKING
DZJA
VOUT VOLTAGE
ADJ
TEMP. RANGE
(°C)
-40 to +125
PACKAGE
(Pb-Free)
10 Ld 3x3 DFN
PKG
DWG. #
L10.3x3
ISL80102IR15Z
DZMA
1.5V (Note 3)
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80102IR18Z
DZNA
1.8V
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80102IR25Z
DZPA
2.5V
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80102IR33Z
DZRA
3.3V (Note 3)
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80102IR50Z
DZSA
5.0V (Note 3)
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80103IRAJZ
DZAA
ADJ
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80103IR15Z
DZDA
1.5V (Note 3)
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80103IR18Z
DZEA
1.8V
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80103IR25Z
DZFA
2.5V
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80103IR33Z
DZGA
3.3V (Note 3)
-40 to +125
10 Ld 3x3 DFN
L10.3x3
ISL80103IR50Z
DZHA
5.0V (Note 3)
-40 to +125
10 Ld 3x3 DFN
L10.3x3
NOTES:
1. Add “-T” or “-TK” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. The 1.5V, 3.3V and 5V fixed output voltages will be released in the future. Please contact Intersil Marketing for more details.
4. For Moisture Sensitivity Level (MSL), please see device information page for ISL80102, ISL80103. For more information on
MSL please see tech brief TB363.
2
FN6660.1
March 22, 2010
 

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