ISL6207CR View Datasheet(PDF) - Intersil
Part Name
Description
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ISL6207CR Datasheet PDF : 9 Pages
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ISL6207
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L8.3x3
8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VEEC ISSUE C)
SYMBOL
A
A1
A2
A3
b
D
D1
MILLIMETERS
MIN
NOMINAL
MAX
0.80
0.90
1.00
-
-
0.05
-
-
1.00
0.20 REF
0.23
0.28
0.38
3.00 BSC
2.75 BSC
NOTES
-
-
9
9
5, 8
-
9
D2
0.25
1.10
1.25
7, 8
E
3.00 BSC
-
E1
2.75 BSC
9
E2
0.25
1.10
1.25
7, 8
e
0.65 BSC
-
k
0.25
-
-
L
0.35
0.60
0.75
8
L1
-
-
0.15
10
N
8
2
Nd
2
3
Ne
2
3
P
-
-
0.60
9
θ
-
-
12
9
Rev. 1 10/02
NOTES:
Intersil Lead Free products employ special lead free material sets;
molding compounds / die attach materials and 100% matte tin plate
termination finish, which is compatible with both SnPb and lead free
soldering operations. Intersil Lead Free products are MSL classified at
lead free peak reflow temperatures that meet or exceed the lead free
requirements of IPC/JEDEC J Std-020B.
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
8
FN9075.7
July 25, 2005
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