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ISL6207HRZ-T View Datasheet(PDF) - Intersil

Part Name
Description
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ISL6207HRZ-T Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
ISL6207
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (VEN, VPWM) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (VBOOT). . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 36V
BOOT to PHASE Voltage (VBOOT-PHASE) . . . . . . . . . . . -0.3V to 7V
PHASE Voltage . . . . . . . . . . . . . GND - 0.3V (DC) to VBOOT + 0.3V
. . . . . . . . . GND - 5V (<100ns Pulse Width, 10µJ) to VBOOT + 0.3V
UGATE Voltage . . . . . . . . . . VPHASE - 0.3V (DC) to VBOOT + 0.3V
. . . . . . .VPHASE - 4V (<200ns Pulse Width, 20µJ) to VBOOT + 0.3V
LGATE Voltage . . . . . . . . . . . . . . GND - 0.3V (DC) to VVCC + 0.3V
. . . . . . . . . . . GND - 2V (<100ns Pulse Width, 4µJ) to VVCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 125°C
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
SOIC Package (Note 2) . . . . . . . . . . . .
110
N/A
QFN Package (Notes 3, 4). . . . . . . . . .
95
36
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-10°C to 100°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current
Bias Supply Current
BOOTSTRAP DIODE
IVCC
IVCC
EN = LOW
PWM pin floating, VVCC = 5V
-
-
5.0
µA
-
30
-
µA
Forward Voltage
PWM INPUT
VF
VVCC = 5V, forward bias current = 2mA
0.45 0.60 0.65
V
Input Current
PWM Three-State Rising Threshold
PWM Three-State Falling Threshold
Three-State Shutdown Holdoff Time
EN INPUT
IPWM
VPWM = 5V
VPWM = 0V
VVCC = 5V
VVCC = 5V
VVCC = 5V, temperature = 25°C
-
250
-
µA
-
-250
-
µA
-
-
1.7
V
3.3
-
-
V
-
300
-
ns
EN LOW Threshold
1.0
-
-
V
EN HIGH Threshold
SWITCHING TIME
UGATE Rise Time (Note 5)
LGATE Rise Time (Note 5)
UGATE Fall Time (Note 5)
LGATE Fall Time (Note 5)
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
tRUGATE
tRLGATE
tFUGATE
tFLGATE
tPDLUGATE
tPDLLGATE
VVCC = 5V, 3nF Load
VVCC = 5V, 3nF Load
VVCC = 5V, 3nF Load
VVCC = 5V, 3nF Load
VVCC = 5V, Outputs Unloaded
VVCC = 5V, Outputs Unloaded
-
-
2.0
V
-
8
-
ns
-
8
-
ns
-
8
-
ns
-
4
-
ns
-
18
-
ns
-
15
-
ns
3
FN9075.7
July 25, 2005
 

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