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ISL29010IROZ View Datasheet(PDF) - Intersil

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ISL29010IROZ Datasheet PDF : 14 Pages
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DLENS
ISL29010
D2 > 1.5mm
LIGHT PIPE
t
L
D2
DLENS
ISL29010
FIGURE 5. WINDOW WITH LIGHT GUIDE/PIPE
Suggested PCB Footprint
It is important that the users check the “Surface Mount
Assembly Guidelines for Optical Dual FlatPack No Lead
(ODFN) Package” before starting ODFN product board
mounting.
http://www.intersil.com/data/tb/TB466.pdf
Layout Considerations
The ISL29010 is relatively insensitive to layout. Like other
I2C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I2C traces as far as possible from all
sources of noise. Use two power-supply decoupling
capacitors, 4.7µF and 0.1µF, placed close to the device.
Typical Circuit
A typical application for the ISL29010 is shown in Figure 6.
The ISL29010’s I2C address is internally hardwired as
1000100. The device can be tied onto a system’s I2C bus
together with other I2C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic
ODFN package does not require a custom reflow soldering
profile, and is qualified to +260°C. A standard reflow
soldering profile with a +260°C maximum is recommended.
9
FN6414.0
February 13, 2008
 

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