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ISL29003 View Datasheet(PDF) - Intersil

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ISL29003 Datasheet PDF : 15 Pages
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ISL29003
1
2.00mm
2
0.29mm
3
2.10mm
6
5
0.56mm
4
0.46mm
FIGURE 6. SENSOR LOCATION DRAWING
Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence
with package pads. Since ambient light sensor devices do
not dissipate high power, heat dissipation through the
exposed pad is not important; instead, similar to DFN or
QFN, the exposed pad provides robustness in board mount
process. Intersil recommends mounting the exposed pad to
the PCB, but this is not mandatory.
Layout Considerations
The ISL29003 is relatively insensitive to layout. Like other
I2C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I2C traces as far as possible from all
sources of noise. Use two power-supply decoupling
capacitors, 4.7µF and 0.1µF, placed close to the device.
Typical Circuit
A typical application for the ISL29003 is shown in Figure 7.
The ISL29003’s I2C address is internally hardwired as
1000100. The device can be tied onto a system’s I2C bus
together with other I2C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic
ODFN package does not require a custom reflow soldering
profile, and is qualified to +260°C. A standard reflow
soldering profile with a +260°C maximum is recommended.
2.5V TO 3.3V
R1 R2 R3
10k 10k RES1
1.8V TO 5.5V
I2C MASTER
MICROCONTROLLER
SDA
SCL
C1 C2
4.7µF 0.1µF
I2C SLAVE_0
1 VDD
SDA 6
2 GND
SCL 5
3 REXT INT 4
REXT
100k
ISL29003
I2C SLAVE_1
SDA
SCL
I2C SLAVE_n
SDA
SCL
FIGURE 7. ISL29003 TYPICAL CIRCUIT
12
FN7464.5
August 8, 2008
 

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