datasheetbank_Logo   Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site
Part Name :   

ISL24003IRZ View Datasheet(PDF) - Intersil

Part NameDescriptionManufacturer
ISL24003IRZ Multi-Channel Buffers Plus VCOM Driver Intersil
Intersil Intersil
ISL24003IRZ Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
ISL24003
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to ground, one 0.1µF ceramic capacitor should be
placed from the VS+ pin to ground. A 4.7µF tantalum
capacitor should then be connected from the VS+ pin to
ground. One 4.7µF capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (VS-). If VS- is tied to ground, the
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
9
FN6118.0
December 7, 2005
Direct download click here
 

Share Link : Intersil
All Rights Reserved © datasheetbank.com 2014 - 2019 [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]