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ISL1208IB8-TK View Datasheet(PDF) - Intersil

Part NameDescriptionManufacturer
ISL1208IB8-TK I2C® Real Time Clock/Calendar Intersil
Intersil Intersil
ISL1208IB8-TK Datasheet PDF : 24 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ISL1208
Absolute Maximum Ratings
Voltage on VDD, VBAT, SCL, SDA, and IRQ Pins (Note 3)
(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Voltage on X1 and X2 Pins
(respect to GND) . . . . . . . . . . . . .-0.5V to VDD + 0.5 (VDD Mode)
-0.5V to VBAT + 0.5 (VBAT Mode)
Latchup (Note 4) ................Class II, Level B @ +85°C
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA (°C/W) θJC (°C/W)
SOIC Package . . . . . . . . . . . . . . . . . . .
95
N/A
MSOP Package . . . . . . . . . . . . . . . . . . 128
N/A
TDFN Package (Note 2). . . . . . . . . . . . 53.7
2.8
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
3. The VDD and SDA pins should not be subjected to negative voltage while the VBAT pin is biased, otherwise latchup can result. See the
Applications section.
4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are using a negative pulse limited to -0.5V.
DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
NOTES (Note 9) (Note 8) (Note 9) UNITS
VDD
VBAT
IDD1
IDD2
IDD3
IBAT
ILI
ILO
VTRIP
VTRIPHYS
VBATHYS
IRQ/FOUT
VOL
Main Power Supply
Battery Supply Voltage
Supply Current
Supply Current With I2C Active
Supply Current (Low Power Mode)
Battery Supply Current
Input Leakage Current on SCL
I/O Leakage Current on SDA
VBAT Mode Threshold
VTRIP Hysteresis
VBAT Hysteresis
VDD = 5V
VDD = 3V
VDD = 5V
VDD = 5V, LPMODE = 1
VBAT = 3V
Output Low Voltage
VDD = 5V
IOL = 3mA
VDD = 2.7V
IOL = 1mA
2.7
5.5
V
1.8
5.5
V
5, 6
2
6
µA
1.2
4
µA
5, 6
40
120
µA
5
1.4
5
µA
5
400
950
nA
100
nA
100
nA
1.6
2.2
2.6
V
10
30
75
mV
15
50
100
mV
0.4
V
0.4
V
Power-Down Timing Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
VDD SR-
PARAMETER
VDD Negative Slewrate
CONDITIONS
NOTES
7
MIN
TYP
MAX
(Note 9) (Note 8) (Note 9)
10
UNITS
V/ms
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified.
SYMBOL
PARAMETER
SERIAL INTERFACE SPECS
VIL
SDA and SCL Input Buffer LOW
Voltage
TEST CONDITIONS
MIN
TYP MAX
NOTES (Note 9) (Note 8) (Note 9) UNITS
-0.3
0.3 x
V
VDD
4
FN8085.8
September 12, 2008
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