ISL12058IUZ View Datasheet(PDF) - Intersil
Part Name
Description
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ISL12058IUZ Datasheet PDF : 19 Pages
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ISL12058
Absolute Maximum Ratings
Voltage on VDD Pin (respect to GND) . . . . . . . . . . . . . . . -0.2V to 4V
Voltage on IRQ/FOUT , SCL and SDA Pins
(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 6V
Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . -0.2V to 4V
ESD Rating ((Per MIL-STD-883 Method 3014)
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>350V
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
8 Lead SOIC (Note 3) . . . . . . . . . . . . . 120
N/A
8 Lead MSOP (Note 3). . . . . . . . . . . . . 169
N/A
8 Lead µTDFN (Note 3) . . . . . . . . . . . . 160
N/A
8 Lead TDFN (Notes 4, 5) . . . . . . . . . .
52
7
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
DC Operating Characteristics – RTC Temperature = -40°C to +85°C unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
(Note 8) (Note 7) (Note 8) UNITS
VDD
VDDT
IDD1
IDD2
IDD3
Main Power Supply
Timekeeping Power Supply
Standby Supply Current
Timekeeping Current
Supply Current With I2C Active at
Clock Speed of 400kHz
VDD = 3.6V
VDD = 3.0V
VDD = 1.8V
VDD = 1.4V
VDD = 3.6V
1.8
3.6
V
1.4
1.8
V
600
950
nA
500
nA
400
650
nA
350
nA
15
40
µA
ILI
ILO
IRQ/FOUT
VOL
Input Leakage Current on SCL
I/O Leakage Current on SDA
Output Low Voltage
VDD = 1.8V, IOL = 3mA
-100
-100
100
nA
100
nA
0.4
V
NOTES
6, 12
6, 12
6
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
(Note 8) TYP (Note 7) (Note 8) UNITS NOTES
SERIAL INTERFACE SPECS
VIL SDA and SCL Input Buffer LOW
Voltage
-0.3
0.3 x VDD V
VIH SDA and SCL Input Buffer HIGH
Voltage
0.7 x VDD
5.5
V
Hysteresis SDA and SCL Input Buffer
Hysteresis
0.04 x VDD
V
VPULLUP
Maximum Pull-up Voltage on SDA
during I2C Communication
VDD + 2 V
11
VOL SDA Output Buffer LOW Voltage, VDD > 1.8V, VPULLUP = 5.0V
0
Sinking 3mA
0.4
V
Cpin
fSCL
SDA and SCL Pin Capacitance
SCL Frequency
TA = +25°C, f = 1MHz, VDD = 5V,
VIN = 0V, VOUT = 0V
10
pF 9, 10
400
kHz
4
FN6756.0
June 15, 2009
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