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ISL12020MIRZ View Datasheet(PDF) - Intersil

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Description
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ISL12020MIRZ Datasheet PDF : 32 Pages
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ISL12020M
Absolute Maximum Ratings
Voltage on VDD, VBAT and IRQ/FOUT pins
(Respect to Ground) . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on SCL and SDA pins
(Respect to Ground) . . . . . . . . . . . -0.3V to VDD + 0.3V
Voltage on X1 and X2 pins
(respect to ground, Note 6) . . . . . . . . . . . -0.3V to 2.5V
ESD Rating
Human Body Model
(Per MIL-STD-883 Method 3014) . . . . . . . . . . . >3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . .>300V
Thermal Information
Thermal Resistance (Typical) θJA (°C/W)
θJC (°C/W)
20 Lead DFN (Notes 4, 5) . . . . . 40
3.5
Storage Temperature . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile (Note 7) . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. The X1 and X2 pins are connected internally to a crystal and should be a floating electrical connection.
7. The ISL12020M Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend on
the reflow temperature and length of exposure. A general rule is to use only one reflow cycle and keep the temperature and
time as short as possible. Changes on the order of ±1ppm to ±3ppm can be expected with typical reflow profiles.
DC Operating Characteristics - RTC Test Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise
stated. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
(Note 8) (Note 9) (Note 8) UNITS NOTES
VDD Main Power Supply
(Note 10)
VBAT
IDD1
IDD2
IDD3
Battery Supply Voltage
Supply Current. (I2C not active,
temperature conversion not active,
FOUT not active)
Supply Current. (I2C active,
temperature conversion not active,
FOUT not active)
Supply Current. (I2C not active,
temperature conversion active,
FOUT not active)
(Note 10)
VDD = 5V
VDD = 3V
VDD = 5V
VDD = 5V
IBAT Battery Supply Current
VDD = 0V, VBAT = 3V,
TA =+25°C
VDD = 0V, VBAT = 3V
IBATLKG Battery Input Leakage
VDD = 5.5V, VBAT = 1.8V
ILI Input Leakage Current on SCL
VIL = 0V, VIH = VDD
ILO I/O Leakage Current on SDA
VIL = 0V, VIH = VDD
VBATM Battery Level Monitor Threshold
VPBM Brownout Level Monitor Threshold
VTRIP VBAT Mode Threshold
(Note 10)
VTRIPHYS VTRIP Hysteresis
VBATHYS VBAT Hysteresis
Fout25°C Oscillator Initial Accuracy
VDD = 3.3V, TA = +25°C
ΔFoutT Oscillator Stability vs Temperature VDD = 3.3V
ΔFoutV Oscillator Stability vs Voltage
2.7V VDD 5.5V
Temperature Sensor Accuracy
VDD = VBAT = 3.3V
2.7
1.8
-1.0
-1.0
-100
-100
2.0
-5
-3
4.1
3.5
200
120
1.0
1.0
±0.1
±0.1
2.2
30
50
±2
±2
5.5
5.5
7
6
500
V
V
11
µA
12, 13
µA
12, 13
µA 12, 13
400
µA 12, 13
1.6
5.0
100
1.0
1.0
+100
+100
2.4
+5
+3
µA
12
µA
nA
µA
µA
mV
mV
V
mV
mV
ppm
ppm
ppm
°C
12
15
15
7, 15
7, 15
15
15
5
FN6667.4
February 11, 2010
 

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