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HLMP-1440-V0NBX View Datasheet(PDF) - Avago Technologies

Part Name
Description
View to exact match
HLMP-1440-V0NBX
AVAGO
Avago Technologies AVAGO
HLMP-1440-V0NBX Datasheet PDF : 12 Pages
First Prev 11 12
Example of Wave Soldering Temperature Profile for TH LED
250
200
150
100
50
0
10 20
TURBULENT WAVE
PREHEAT
30 40 50 60
TIME (MINUTES)
LAMINAR
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
70 80 90 100 Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
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