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232EIBNZ View Datasheet(PDF) - Intersil

Part Name
Description
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232EIBNZ Datasheet PDF : 22 Pages
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HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Ordering Information (Continued)
PART NO.
TEMP.
PART RANGE
MARKING (°C)
PACKAGE
PKG.
DWG. #
HIN208EIAZ
(Note)
HIN208EIAZ -40 to 85 24 Ld SSOP M24.209
(Pb-free)
HIN208EIAZ-T HIN208EIAZ 24 Ld SSOP Tape and M24.209
(Note)
Reel (Pb-free)
HIN208EIB
HIN208EIB -40 to 85 24 Ld SOIC M24.3
HIN208EIBZ
(Note)
HIN208EIBZ -40 to 85 24 Ld SOIC
(Pb-free)
M24.3
HIN211ECA
HIN211ECA 0 to 70 28 Ld SSOP M28.209
HIN211ECA-T HIN211ECA 28 Ld SSOP Tape and M28.209
Reel
HIN211ECAZ
(Note)
HIN211ECAZ 0 to 70 28 Ld SSOP
(Pb-free)
M28.209
HIN211ECAZ-T HIN211ECAZ 28 Ld SSOP Tape and M28.209
(Note)
Reel (Pb-free)
HIN211ECB
HIN211ECB 0 to 70 28 Ld SOIC M28.3
HIN211ECBZ
(Note)
HIN211ECBZ 0 to 70 28 Ld SOIC
(Pb-free)
M28.3
HIN211ECBZ-T HIN211ECBZ 28 Ld SOIC Tape and
(Note)
Reel (Pb-free)
M28.3
HIN211EIA
HIN211EIA -40 to 85 28 Ld SSOP M28.209
HIN211EIA-T
HIN211EIA 28 Ld SSOP Tape and M28.209
Reel
HIN211EIAZ
(Note)
HIN211EIAZ -40 to 85 28 Ld SSOP M28.209
(Pb-free)
HIN211EIAZ-T HIN211EIAZ 28 Ld SSOP Tape and M28.209
(Note)
Reel (Pb-free)
HIN211EIB
HIN211EIB -40 to 85 28 Ld SOIC M28.3
HIN211EIBZ
(Note)
HIN211EIBZ -40 to 85 28 Ld SOIC
(Pb-free)
M28.3
HIN213ECA
HIN213ECA 0 to 70 28 Ld SSOP M28.209
HIN213ECA-T HIN213ECA 28 Ld SSOP Tape and M28.209
Reel
HIN213ECAZ
(Note)
HIN213ECAZ 0 to 70 28 Ld SSOP
(Pb-free)
M28.209
HIN213ECAZ-T HIN213ECAZ 28 Ld SSOP Tape and M28.209
(Note)
Reel (Pb-free)
HIN213EIA
HIN213EIA -40 to 85 28 Ld SSOP M28.209
HIN213EIA-T
HIN213EIA 28 Ld SSOP Tape and M28.209
Reel
HIN213EIAZ
(Note)
HIN213EIAZ -40 to 85 28 Ld SSOP M28.209
(Pb-free)
HIN213EIAZ-T HIN213EIAZ 28 Ld SSOP Tape and M28.209
(Note)
Reel (Pb-free)
HIN213EIB
HIN213EIB -40 to 85 28 Ld SOIC M28.3
HIN213EIBZ
(Note)
HIN213EIBZ -40 to 85 28 Ld SOIC
(Pb-free)
M28.3
Ordering Information (Continued)
PART NO.
TEMP.
PART RANGE
MARKING (°C)
PACKAGE
PKG.
DWG. #
HIN232ECA
HIN232ECA 0 to 70 16 Ld SSOP M16.209
HIN232ECA-T HIN232ECA 16 Ld SSOP Tape and M16.209
Reel
HIN232ECAZ-T HIN232ECAZ 16 Ld SSOP Tape and M16.209
(Note)
Reel (Pb-free)
HIN232ECB
HIN232ECB 0 to 70 16 Ld SOIC (W) M16.3
HIN232ECB-T HIN232ECB 16 Ld SOIC (W) Tape and M16.3
Reel
HIN232ECBN HIN232ECBN 0 to 70 16 Ld SOIC (N) M16.15
HIN232ECBN-T HIN232ECBN 16 Ld SOIC (N) Tape and M16.15
Reel
HIN232ECBNZ 232ECBNZ
(Note)
0 to 70 16 Ld SOIC (N) M16.15
(Pb-free)
HIN232ECBNZ-T 232ECBNZ 16 Ld SOIC (N) Tape and M16.15
(Note)
Reel (Pb-free)
HIN232ECBZ
(Note)
232ECBZ
0 to 70 16 Ld SOIC (W) M16.3
(Pb-free)
HIN232ECBZ-T 232ECBZ
(Note)
16 Ld SOIC (W) Tape and M16.3
Reel (Pb-free)
HIN232ECP
HIN232ECP 0 to 70 16 Ld PDIP E16.3
HIN232ECPZ
(Note)
HIN232ECPZ 0 to 70 16 Ld PDIP*
(Pb-free)
E16.3
HIN232EIBN HIN232EIBN -40 to 85 16 Ld SOIC (N) M16.15
HIN232EIBN-T HIN232EIBN 16 Ld SOIC (N) Tape and M16.15
Reel
HIN232EIBNZ 232EIBNZ
(Note)
-40 to 85 16 Ld SOIC (N) M16.15
(Pb-free)
HIN232EIBNZ-T 232EIBNZ
(Note)
16 Ld SOIC (N) Tape and M16.15
Reel (Pb-free)
HIN232EIV
HIN232EIV -40 to 85 16 Ld TSSOP M16.173
HIN232EIV-T
HIN232EIV 16 Ld TSSOP Tape and M16.173
Reel
HIN232EIVZ
(Note)
232EIVZ
-40 to 85 16 Ld TSSOP M16.173
(Pb-free)
HIN232EIVZ-T 232EIVZ
(Note)
16 Ld TSSOP Tape and M16.173
Reel (Pb-free)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
3
FN4315.16
November 4, 2005
 

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