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202ECPZ(2015) View Datasheet(PDF) - Intersil

Part Name
Description
View to exact match
202ECPZ Datasheet PDF : 24 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Ordering Information (Continued)
PART NO.
(Note 1)
PART MARKING
TEMP. RANGE
(°C)
PACKAGE
(RoHS Compliant)
PKG. DWG. #
HIN232ECAZ
HIN232ECAZ
16 Ld SSOP
M16.209
HIN232ECAZ-T (Note 2)
HIN232ECAZ
16 Ld SSOP Tape and Reel
M16.209
HIN232ECBNZ
232ECBNZ
16 Ld SOIC (N)
M16.15
HIN232ECBNZ-T (Note 2)
232ECBNZ
0 to 70
16 Ld SOIC (N) Tape and Reel M16.15
HIN232ECBZ
232ECBZ
16 Ld SOIC (W)
M16.3
HIN232ECBZ-T (Note 2)
232ECBZ
16 Ld SOIC (W) Tape and Reel M16.3
HIN232ECPZ
HIN232ECPZ
16 Ld PDIP*
E16.3
HIN232EIBNZ
232EIBNZ
16 Ld SOIC (N)
M16.15
HIN232EIBNZ-T (Note 2)
232EIBNZ
16 Ld SOIC (N) Tape and Reel M16.15
HIN232EIVZ
(No longer available,
recommended replacement:
HIN232ECAZ)
232EIVZ
-40 to 85
16 Ld TSSOP
M16.173
HIN232EIVZ-T (Note 2)
(No longer available,
recommended replacement:
HIN232ECAZ-T)
232EIVZ
16 Ld TSSOP Tape and Reel
M16.173
*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTES:
1. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Please refer to TB347 for details on reel specifications.
3
FN4315.17
September 14, 2015
 

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