HCPL-0370 View Datasheet(PDF) - HP => Agilent Technologies

Part Name

Description

View to exact match

HCPL-0370

AC/DC to Logic Interface Optocouplers

HP => Agilent Technologies 

5

Solder Reflow Thermal Profile

300

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK

TEMP.

245°C

200

160°C

150°C

140°C

100

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

PREHEATING TIME

150°C, 90 + 30 SEC.

30

SEC.

30

SEC.

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

50 SEC.

ROOM

TEMPERATURE

0

0

TIGHT

TYPICAL

LOOSE

50

100

150

200

250

TIME (SECONDS)

Recommended Pb-Free IR Profile

tp

Tp

260 +0/-5 °C

TL 217 °C

RAMP-UP

3 °C/SEC. MAX.

Tsmax 150 - 200 °C

Tsmin

ts

PREHEAT

tL

60 to 180 SEC.

TIME WITHIN 5 °C of ACTUAL

PEAK TEMPERATURE

20-40 SEC.

RAMP-DOWN

6 °C/SEC. MAX.

60 to 150 SEC.

25

t 25 °C to PEAK

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200 °C, Tsmin = 150 °C

Regulatory Information

The HCPL-0370/3700/3760 has

been approved by the following

organizations:

UL

Recognized under UL 1577,

component recognition program,

File E55361 (HCPL-0370

pending).

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

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