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HCPL-0453-600 View Datasheet(PDF) - HP => Agilent Technologies

Part Name
Description
View to exact match
HCPL-0453-600
HP
HP => Agilent Technologies HP
HCPL-0453-600 Datasheet PDF : 17 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6,
HCNW4502/3)
11.15 ± 0.15
(0.442 ± 0.006)
PAD LOCATION (FOR REFERENCE ONLY)
8
7
6
5
9.00 ± 0.15
(0.354 ± 0.006)
1
2
3
4
(06.2.1452)TYP.
12.30 ± 0.30
(0.484 ± 0.012)
1.55
(0.061)
MAX.
(04.1.0508)MAX.
1.3
(0.051)
0.9
(0.035)
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
1.00 ± 0.15
(0.039 ± 0.006)
0.254
+ 0.076
- 0.0051
(0.010+-
0.003)
0.002)
7° NOM.
Solder Reflow Temperature Profile (HCPL-0500/1, HCPL-0452/3, and Gull Wing
Surface Mount Option Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
T = 115°C, 0.3°C/SEC
T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
T = 145°C, 1°C/SEC
9 10 11 12
Note: Use of Non-Chlorine Activated Fluxes is Recommended.
1-21
 

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